WebSmoothie. Quick view. Diced Chips and Pico. Quick view. Diced Chips & Avocado Smash (Aka Guacamole) Loaded Chips. Chips loaded with corn, black beans, avocado smash, pico, cheese, cilantro and topped with our garlic cilantro sauce! Quick view. Sauce Bottle. In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser … See more Dicing of silicon wafers may also be performed by a laser-based technique, the so-called stealth dicing process. It works as a two-stage process in which defect regions are firstly introduced into the wafer by scanning the … See more The DBG or "dice before grind" process is a way to separate dies without dicing. The separation occurs during the wafer thinning step. The … See more • Wafer bonding See more
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